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Hengyu Liu

刘恒宇

The Chinese University of Hong Kong

About Me

I am a first year Mphil student at the Deparment of Electronic Engineering, The Chinese University of Hong Kong. I received my B.E. degree at the College of Intelligence and Computing, Tianjin University, where I have grad honor to work closely with Prof. Changqing Zhang. I'm currently focusing on 3D Computer Vision, especially VLM for 3D and 3D Feed Forward Models.

Recent News

  • [2025.02] FlexGS is accepted by CVPR 2025. Thanks to all the co-authors!
  • [2025.01] Hide-In-Motion is accepted by ICRA 2025. Thanks to all the co-authors!

Selected Publications

* denotes equal contribution; denotes corresponding author
FlexGS: Train Once, Deploy Everywhere with Many-in-One Flexible 3D Gaussian Splatting
Hengyu Liu*, Yuehao Wang*, Chenxin Li*, Ruisi Cai, Kevin Wang, Wuyang Li, et al.
CVPR 2025 
InstantSplamp: Fast and Generalizable Stenography Framework for Generative Gaussian Splatting
Chenxin Li*, Hengyu Liu*, Zhiwen Fan, Wuyang Li, et al.
ICLR 2025 
Hide-in-Motion: Embedding Steganographic Copyright Information into 4D Gaussian Splatting Assets
Hengyu Liu*, Chenxin Li*, Wentao Pan, Zhiqin Yang, et al.
ICRA 2025 
LGS: A Light-weight 4D Gaussian Splatting for Efficient Surgical Scene Reconstruction
Hengyu Liu*, Yifan Liu*, Chenxin Li*, Wuyang Li, et al.
MICCAI 2024 
Endora: Video Generation Models as Endoscopy Simulators
Chenxin Li*, Hengyu Liu*, Yifan Liu*, Brandon Y. Feng, Wuyang Li, et al.
MICCAI 2024 
ConcealGS: Concealing Invisible Copyright Information in 3D Gaussian Splatting
Yifeng Yang*, Hengyu Liu*, Yining Sun, Wuyang Li et al.
ICASSP 2025 

Education

Department of Electronic Engineering, The Chinese University of Hong Kong
 
M.Phil. in Electronic Engineering 
From Sep. 2024 to Jul. 2026 (expected) 
College of Intelligence and Computing, Tianjin University
 
B.E. in Artificial Intelligence 
From Sep. 2020 to Jul. 2024 
GPA: 3.93/4.00, Ranking: 1/69 
Supervisor: Prof. Changqing Zhang 

Awards

  • Outstanding Undergraduate Thesis of Tianjin University, 2024.
  • Outstanding Graduates of Tianjin University, 2024.
  • Kiyoshi Honda Speech Science Scholarship, 2023.
  • Outstanding Student of Tianjin University, 2022.
  • Huawei Smart Base Scholarship, 2022.

Services

Conference Reviewer

  • CVPR 2025, AAAI 2025, ICASSP 2025, IJCNN 2025.