Hengyu Liu
M.Phil. Student
Department of Electronic Engineering
The Chinese University of Hong Kong
About Me
I am a second-year M.Phil. student at the Department of EE, The Chinese University of Hong Kong, supervised by Prof. Yixuan Yuan. I received my B.E. at Tianjin University, where I had the honor to work closely with Prof. Changqing Zhang. I'm currently focusing on 3D Computer Vision and its interaction with Video World Model.
Recent News
- [2025.09] IR3D-Bench is accepted by NeurIPS 2025.
- [2025.02] FlexGS is accepted by CVPR 2025.
- [2025.01] Hide-In-Motion is accepted by ICRA 2025.
- [2025.01] InstantSplamp is accepted by ICLR 2025.
- [2024.07] LGS, Endora is accepted by MICCAI 2024.
Selected Publications
My research currently focusing on Vision-Language Model and 3D Computer Vision. Below are my publications.* denotes equal contribution;
IR3D-Bench: Evaluating Vision-Language Model Scene Understanding as Agentic Inverse Rendering
NeurIPS 2025
Education
The Chinese University of Hong Kong
M.Phil. in Electronic Engineering
Sep. 2024 - Jul. 2026 (expected)
Tianjin University
B.E. in Artificial Intelligence
Sep. 2020 - Jul. 2024
GPA: 3.93/4.00, Ranking: 1/69
Awards
- NeurIPS 2025 Scholar Award, 2025.
- Outstanding Undergraduate Thesis of Tianjin University, 2024.
- Outstanding Graduates of Tianjin University, 2024.
- Outstanding Student of Tianjin University, 2022.
Services
Conference Reviewer
- ICLR 2026, ICML 2026, CVPR 2025, AAAI 2025-2026, ICASSP 2025-2026, IJCNN 2025-2026.
Journal Reviewer
- Pattern Recognition.
Teaching Assistant
- ELEG2310B, CUHK, 2024-2025 Fall;
- ENGG1130, CUHK, 2024-2025 Spring;